Part Number Hot Search : 
B2322BS1 VN2460 5EETT LP1500 BGX885 TMP05 5NCF10KE DT54F
Product Description
Full Text Search
 

To Download ESD5004 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  ? semiconductor components industries, llc, 2015 august, 2015 ? rev. 2 1 publication order number: ESD5004/d ESD5004 esd protection diode low capacitance esd protection diode the ESD5004 is designed for applications requiring esd protection. it is intended to be used in sensitive equipment such as smartphone, wireless headsets, digital cameras, computers, printers, communication systems, and other applications. the integrated design provides very effective and reliable protection for four separate lines using only one package. this device is ideal for situations where board space is at a premium. features ? low capacitance (5 pf max, i/o to gnd) ? four separate bi?directional configurations for protection ? protection for the following iec standards: iec 61000?4?2 (level 4) ? low esd clamping voltage ? these devices are pb?free, halogen free/bfr free and are rohs compliant typical applications ? smartphone and portable electronics ? notebooks, desktops, servers ? microprocessor based equipment maximum ratings (t j = 25 c unless otherwise noted) rating symbol value unit operating junction temperature range t j ?55 to +125 c storage temperature range t stg ?65 to +150 c lead solder temperature ? maximum (10 seconds) t l 260 c iec 61000?4?2 contact (esd) iec 61000?4?2 air (esd) esd esd 10 15 kv kv stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. see application note and8308/d for further description of survivability specs. marking diagram device package shipping ? ordering information x3dfn4 case 714aa pin configuration and schematic www. onsemi.com ESD5004mxtbg x3dfn4 (pb?free) 8000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. (bottom view) 2 1 3 4 5 5 1234 4 = specific device code m = date code 4m
ESD5004 www. onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise specified) parameter symbol conditions min typ max unit reverse working voltage v rwm i/o pin to gnd 3.3 v breakdown voltage v br i t = 1 ma, i/o pin to gnd 3.9 v reverse leakage current i r v rwm = 3.3 v, i/o pin to gnd 1.0  a clamping voltage v c 8 x 20  s, ipp = 1 a 5.0 9.1 v clamping voltage tlp (note 1) see figures 4 and 5 v c i pp = 16 a i pp = ?16 a iec 61000?4?2 level 4 equivalent ( 8 kv contact, 15 kv air) 10 4.5 v junction capacitance c j v r = 0 v, f = 1 mhz between i/o pins and gnd 3.5 5.0 pf product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. ansi/esd stm5.5.1 ? electrostatic discharge sensitivity testing using transmission line pulse (tlp) model. tlp conditions: z 0 = 50  , t p = 100 ns, t r = 4 ns, averaging window; t 1 = 30 ns to t 2 = 60 ns. iec 61000?4?2 spec. level test volt- age (kv) first peak current (a) current at 30 ns (a) current at 60 ns (a) 1 2 7.5 4 2 2 4 15 8 4 3 6 22.5 12 6 4 8 30 16 8 i peak 90% 10% iec61000?4?2 w aveform 100% i @ 30 ns i @ 60 ns t p = 0.7 ns to 1 ns figure 1. iec61000?4?2 spec
ESD5004 www. onsemi.com 3 typical characteristics tlp current (a) v c , voltage (v) equivalent v iec (kv) 20 18 16 14 12 10 8 6 4 2 00 8 6 4 2 020 18 16 14 2468 12 10 tlp current (a) equivalent v iec (kv) ?20 0 8 6 4 2 020 18 16 14 2468 12 10 v c , voltage (v) ?18 ?16 ?14 ?12 ?10 ?8 ?6 ?4 ?2 0 10 10 figure 2. iec61000?4?2 +8 kv contact esd clamping voltage figure 3. iec61000?4?2 ?8 kv contact esd clamping voltage figure 4. positive tlp i?v curve figure 5. negative tlp i?v curve figure 6. cv characteristics v r , voltage (v) 3.0 2.5 3.5 2.0 1.5 1.0 0.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 c (pf) 3.5 4.0 time (ns) 100 80 140 60 40 20 0 ?20 ?5 0 5 10 15 20 25 45 voltage (v) 30 35 40 120 time (ns) 100 80 140 60 40 20 0 ?20 ?45 ?40 ?35 ?30 ?25 ?20 ?15 5 voltage (v) ?10 ?5 0 120 i/o?gnd
ESD5004 www. onsemi.com 4 transmission line pulse (tlp) measurement transmission line pulse (tlp) provides current versus voltage (i?v) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. a simplified schematic of a typical tlp system is shown in figure 7. tlp i?v curves of esd protection devices accurately demonstrate the product?s esd capability because the 10s of amps current levels and under 100 ns time scale match those of an esd event. this is illustrated in figure 8 where an 8 kv iec 61000?4?2 current waveform is compared with tlp current pulses at 8 a and 16 a. a tlp i?v curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. for more information on tlp measurements and how to interpret them please refer to and9007/d. figure 7. simplified schematic of a typical tlp system dut l s oscilloscope attenuator 10 m  v c v m i m 50  coax cable 50  coax cable figure 8. comparison between 8 kv iec 61000?4?2 and 8 a and 16 a tlp waveforms
ESD5004 www. onsemi.com 5 package dimensions x3dfn4 0.525x0.925, 0.3p case 714aa issue b a b e d bottom view b 0.05 c top view 0.05 c a a1 0.05 c 0.05 c c seating plane side view dim min max millimeters a 0.24 0.32 a1 0.00 0.05 b 0.12 0.18 e 0.925 bsc e 0.30 bsc solder footprint* dimensions: millimeters 1.08 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1 l 0.18 recommended l 0.173 0.233 l2 0.42 0.48 e e/2 5x 4x 5x 0.66 0.38 4x pin one reference note 3 1 a m 0.07 b c 2x 2x l2 2 43 note 3 d 0.525 bsc 0.30 pitch on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 ESD5004/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative


▲Up To Search▲   

 
Price & Availability of ESD5004

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X